New soldering processes and solder systems for hybrid microsystems: Developments and applications

Microsystem Technologies

Volumn 12, Issue 7, 2006, Pages 620-625

  Bobzin, K ^a   Lugscheider, E ^a   Zhuang, H ^a   Ernst, F ^a   Bagcivan, N ^a   Maes, M ^a   Rosing J ^a   Ferrara, S ^a   Erdle, A ^a   Kramer A ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

Author keywords

Active soldering; MST; Pulsed magnetron sputtering; PVD; TLP bonding

Indexed keywords

BONDING; GEOMETRY; MAGNETRON SPUTTERING; MICROSTRUCTURE; THERMAL EFFECTS; VAPOR DEPOSITION;

ACTIVE SOLDERING; FLEXIBILITY; HYBRID MICROSYSTEMS; MST; TRANSIENT LIQUID PHASE (TLP) BONDING;

SOLDERING;

EID: 33744933698     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0079-1     Document Type: Article

References (11)

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