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Journal of Physics: Conference Series
Volumn 34, Issue 1, 2006, Pages 235-240
Reliability modelling and analysis of thermal MEMS
Author keywords

FMEA; MEMS reliability; Thermal actuator; Virtual prototype
Indexed keywords

EID: 33744507025     PISSN: 17426588     EISSN: 17426596     Source Type: Conference Proceeding    
DOI: 10.1088/1742-6596/34/1/039     Document Type: Article
Times cited : (20)
References (7)
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    • Field, L.A.1    Burriesci, D.L.2    Robrish, P.R.3    Ruby, R.C.4
  • 4
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    • Applications for surface micro machined polysilicon thermal actuators and arrays
    • 10.1016/S0924-4247(97)80220-8 0924-4247 A
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    • Comtois, J.H.1    Bright, V.M.2
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    • Analysis and design of polysilicon thermal flexure actuator
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    • Huang Q-A, N K S Lee 1999 Analysis and design of polysilicon thermal flexure actuator J. Micromech. Microeng 9 64-70
    • (1999) J. Micromech. Microeng , vol.9 , Issue.1 , pp. 64-70
    • Huang, Q.-A.1    Lee, N.K.S.2
  • 6
    • 0030182958 scopus 로고    scopus 로고
    • Electrothermal response of lineshape microstructures
    • 10.1016/S0924-4247(96)01247-2 0924-4247 A
    • Lin L, M Chiao 1996 Electrothermal response of lineshape microstructures Sensors Actuators A 55 35-41
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    • Lin, L.1    Chiao, M.2

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.