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Volumn 45, Issue 4 B, 2006, Pages 3822-3827

Thinning technology for lithium niobate wafer by surface activated bonding and chemical mechanical polishing

Author keywords

Chemical mechanical polishing; Lithium niobate (LiNbO3) substrate; Plasma; Wafer bonding

Indexed keywords

CHEMICAL MECHANICAL POLISHING; LITHIUM NIOBATE; PLASMAS; SUBSTRATES; SURFACE ROUGHNESS; SURFACE TREATMENT;

LITHIUM NIOBATE (LINBO3) SUBSTRATE; PLASMA AMBIENTS; SURFACE ACTIVATED BONDING; WAFER BONDING;

WSI CIRCUITS;

EID: 33646909650 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.45.3822 Document Type: Article

Times cited : (34)

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