Polymer adsorption effects on stabilities and chemical mechanical polishing properties of ceria particles

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 45, Issue 5 A, 2006, Pages 4196-4200

  Shimono, Norifumi ^a   Koyama, Naoyuki ^b   Kawaguchi, Masami ^a  

^a MIE UNIVERSITY   (Japan)

^b High Performance Materials Department   (Japan)

Author keywords

Ceria particles; CMP; Poly(vinyl pyrrolidone); Polymer adsorption; Removal rate; Steric stabilization

Indexed keywords

BACKSCATTERING; MOLECULAR WEIGHT; POLISHING; SILICON COMPOUNDS; THIN FILMS; WATER;

CERIA PARTICLES; CMP; POLYMER ADSORPTION; POLYVINYL PYRROLIDONE; STERIC STABILIZATION;

ORGANIC POLYMERS;

EID: 33646858139     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.45.4196     Document Type: Article

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