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Volumn 91, Issue 4, 2003, Pages 581-592

Current criticalities and innovation perspectives in flash memory design automation

Author keywords

Analog mixed signal verification; Automated layout design; Circuit simulation and modeling; Package signal integrity analysis

Indexed keywords

AUTOMATION; COMPUTER ARCHITECTURE; COMPUTER SIMULATION; CONSTRAINT THEORY; SOFTWARE ENGINEERING; STATISTICAL METHODS;

EID: 33646839454     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/JPROC.2003.811710     Document Type: Review
Times cited : (3)

References (18)
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    • A. Rofougaran and A. Abidi, "A table lookup FET model for accurate analog circuit simulations," IEEE Trans. Computer-Aided Design, vol. 12, pp. 324-335, Feb. 1993.
    • (1993) IEEE Trans. Computer-aided Design , vol.12 , pp. 324-335
    • Rofougaran, A.1    Abidi, A.2
  • 9
    • 0032641398 scopus 로고    scopus 로고
    • Parametric yield formulation of MOS IC's affected by mismatch effect
    • May
    • M. Conti, P. Crippa, S. Orcioni, and C. Turchetti, "Parametric yield formulation of MOS IC's affected by mismatch effect," IEEE Trans. Computer-Aided Design, vol. 18, pp. 582-596, May 1999.
    • (1999) IEEE Trans. Computer-aided Design , vol.18 , pp. 582-596
    • Conti, M.1    Crippa, P.2    Orcioni, S.3    Turchetti, C.4
  • 12
    • 6144235465 scopus 로고
    • Analogue and mixed-signal IC design
    • Feb.
    • R. Massara and K. Steptoe, "Analogue and mixed-signal IC design," IEE Review, vol. 38, pp. 75-79, Feb. 1992.
    • (1992) IEE Review , vol.38 , pp. 75-79
    • Massara, R.1    Steptoe, K.2
  • 16
    • 0000518308 scopus 로고    scopus 로고
    • Simulation of high-speed interconnects
    • May
    • R. Achar and M. Nakhla, "Simulation of high-speed interconnects," Proc. IEEE, vol. 89, pp. 693-728, May 2001.
    • (2001) Proc. IEEE , vol.89 , pp. 693-728
    • Achar, R.1    Nakhla, M.2
  • 17
  • 18
    • 33646824742 scopus 로고    scopus 로고
    • Electrical characterization of glass ceramic SCM/MCM packages for high frequency computer wireless and wired communication systems
    • SEMICON West
    • E. Pillai, "Electrical characterization of glass ceramic SCM/MCM packages for high frequency computer wireless and wired communication systems," in Advanced Packaging Technologies Tutorial: SEMICON West, 1999.
    • (1999) Advanced Packaging Technologies Tutorial
    • Pillai, E.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.