Modeling the motion of slurry nanoparticles during chemical mechanical polishing

American Society of Mechanical Engineers, Tribology Division, TRIB

Volumn , Issue 16, 2005, Pages 263-271

  Terrell, Elon J ^a   Jasti, Venkata K ^a   Higgs III, C Fred ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVE NANOSCALE PARTICLES; CHEMICAL MECHANICAL POLISHING (CMP); LAGRANGIAN REFERENCE FRAMES; WAFER SURFACES;

CHEMICAL POLISHING; COMPUTER SIMULATION; MACHINING; MATHEMATICAL MODELS; POLYMERS; SLURRIES; WEAR OF MATERIALS;

NANOSTRUCTURED MATERIALS;

EID: 33646706877     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2005-82331     Document Type: Conference Paper

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