Two-phase hydrodynamic modeling of particulate fluids in sliding contacts

Proceedings of the World Tribology Congress III - 2005

Volumn , Issue , 2005, Pages 511-512

  Terrell, Elon ^a   Garcia, Jonathan ^a   Higgs III, C Fred ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COMPUTER SIMULATION; TRIBOLOGY;

MATERIAL REMOVAL RATE (MRR); METALLIC LAYERS; SUSPENDED PARTICLES;

HYDRODYNAMICS;

EID: 32844468833     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/wtc2005-63778     Document Type: Conference Paper

References (5)

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2. Mazaheri, A.R. and G. Ahmadi, Modeling the effect of bumpy abrasive particles on chemical mechanical polishing. Journal of the Electrochemical Society, 2002. 149(7): p. 370-375.
3. Higgs, C.F., S. H. Ng., L. Borucki, and S. Danyluk, A Mixed-Lubrication Approach to Predicting CMP Fluid Pressure: Modeling and Experiments. Journal of the Electrochemical Society, 2005. 152(3): p. 1-6.
4. Zhao, Y. and L. Chang, A micro-contact and wear model for chemical-mechanical polishing of silicon wafers. Wear, 2002. 252(3-4): p. 220-226.
5. Saffman, P.G., Lift on small sphere in slow shear flow. Journal of Fluid Mechanics, 1965. 22(Part 2): p. 385-400.