Interfacial peeling moments and shear forces at free edges of multilayers subjected to thermal stresses

Journal of the American Ceramic Society

Volumn 89, Issue 5, 2006, Pages 1632-1638

  Hsueh, C H ^a,d   Luttrell, C R ^a   Lee, S ^b   Wu, T C ^c   Lin, H Y ^c  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^c INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^d AMERICAN CERAMIC SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CLOSED-FORM SOLUTIONS; INTERFACIAL PEELING MOMENTS; SHEAR FORCES;

COMPUTATIONAL COMPLEXITY; FINITE ELEMENT METHOD; PEELING; PROBLEM SOLVING; SHEAR STRESS; THERMAL STRESS;

MULTILAYERS;

EID: 33646574636     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2006.00924.x     Document Type: Article

References (31)

1. S. Timoshenko, "Analysis of Bi-Metal Thermostats," J. Opt. Soc. Am. 11. 233-55 (1925).
2. S. M. Hu, "Stress-Related Problems in Silicon Technology." J. Appl, Phys., 70 [6] R53-80 (1991).
3. W. T. Chen and C. W. Nelson, "Thermal Stress in Bonded Joints," IBM J. Res. Develop., 23 [2] 179-88 (1979).
4. E. Suhir, "Interfacial Stresses in Bimetal Thermostats," ASME J. Appl. Mech., 56. 595-600 (1989).
5. Y. H. Pao and E. Eisele, "Interfacial Shear and Peel Stresses in Multilayered Assemblies," ASME J. Electron. Packaging, 113, 164-72 (1991).
6. C. Q. Ru, "Interfacial Thermal Stresses in Bimaterial Beams: Modified Beam Models Revisited." ASME J. Electron, Packaging, 124 [1] 141-6 (2002).
7. M. S. Hess, "The End Problem for a Laminated Elastic Strip-1. The General Solution," J. Compos. Mater., 3, 262-80 (1969).
8. S. S. Wang and I. Choi, "Boundary-Layer Effects in Composite Laminates: Part 1- Free-Edge Stress Singularities," J. Appl. Mech., 49. 541-8 (1982).
9. W. L. Yin. "Interfacial Thermal Stresses in Layered Structures: The Stepped Edge Problem," ASME J. Electron. Packaging., 117. 153-8 (1995).
10. D. W. Sweet and G. R. Shiflett, "Edge Stress in a Composite Strip Subjected to Axial Temperature Gradients: Part 1 - Development of the Theoretical Solution," J. Compos. Mater., 31 [13] 1334-61 (1977).
11. H. H. Yu, M. Y. He, and J. W. Hutchinson, "Edge Effects in Thin Film Delamination," Acta Mater., 49 [1] 93-107 (2001).
12. C. Kassapoglou and P. A. Lagace, "An Efficient Method for the Calculation of Interlaminar Stresses in Composite Materials." J. Appl. Mech., 53, 744-50 (1986).
13. J. P. H. Webber and S. K. Morton, "An Analytical Solution for the Thermal Stresses at the Free Edges of Laminated Plates," Compos. Sci. Technol, 46, 175-85 (1993).
14. W. Xie and S. K. Sitaraman, "Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures," ASME J. Electron, Packaging, 122, 61-6 (2000).
15. A. S. D. Wang and F. W. Crossman. "Edge Effects on Thermally Induced Stresses in Composite Laminates." J. Compos. Mater., 11, 300-12 (1977).
16. S. Sakai, K. Kawasaki, and N. Wada. "Stress-Distribution Analysis in Structured GaAs-Layers Fabricated on Si-Substrates." Jpn. J. Appl. Phys., 29 [6] L853-5 (1990).
17. S. C. Jain, A. H. Harker, A. Atkinson, and K. Pinardi, "Edge-Induced Stress and Strain in Stripe Films and Substrates A 2-Dimensional Finite-Element Calculation." J. Appl. Phys., 78 [3] 1630-7 (1995).
18. J. W. Eischen, C. Chung, and J. H. Kim, "Realistic Modeling of Edge Effect Stresses in Bimaterial Elements," J. Electron, Packaging, 112, 16-23 (1990).
19. T. D. Moore and J. L. Jarvis, "A Simple and Fundamental Design Rule for Resisting Delamination in Bimaterial Structures." Microelectron, Reliability, 43 [3] 487-94 (2003).
20. T. D. Moore, "Thermomechanical Peeling in Multilayer Beams and Plates - A Solution from First Principles," Int. J. Solids. Struct., 42, 271-85 (2005).
21. 1-x Transition Zone on the Perfection of GaP Crystals Grown by Deposition onto GaAs Substrates," J. Appl. Phys., 40 [8] 3273-9 (1969).
22. G. H. Olsen and M. Ettenberg, "Calculated Stresses in Multilayered Hereroepitaxial Structures," J. Appl. Phys., 48 [6] 2543-7 (1977).
23. Z. C. Feng and H. D. Liu, "Generalized Formula for Curvature Radius and Layer Stresses Caused by Thermal Strain in Semiconductor Multilayer Structures," J. Appl. Phys., 54 [1] 83-5 (1983).
24. H. C. Liu and S. P. Murarka, "Elastic and Viscoelastic Analysis of Stress in Thin Films," J. Appl. Phys., 72 [8] 3458-63 (1992).
25. C. H. Hsueh, "Thermal Stresses in Elastic Multilayer Systems," Thin Solid Film, 418 [2] 182-8 (2002).
26. C. H. Hsueh and A. G. Evans. "Residual Stresses in Metal/Ceramic Bonded Strips." J. Am. Ceram. Soc., 68 [5] 241-8 (1985).
27. 3Al," Acta Mater., 44 [9] 3813-21 (1996).
28. J. S. Wang and A. G. Evans, "Measurement and Analysis of Buckling and Buckle Propagation in Compressed Oxide Layers on Superalloy Substrates," Acta Mater., 46 [14] 4993-5005 (1998).
29. S. R. Choi, J. W. Hutchinson, and A. G. Evans, "Delamination of Multilayer Thermal Barrier Coatings." Mech. Mater., 31, 431-47 (1999).
30. M. Y. He, A. G. Evans, and A. Yehle, "Criterion of the Avoidance of Edge Cracking in Layered Systems," J. Am. Ceram, Soc., 87 [8] 1418-23 (2004).
31. M. Y. He, D. R. Mumm, and A. G. Evans. "Criteria for the Delamination of Thermal Barrier Coatings: With Application to Thermal Gradients." Surf. Coat. Technol., 185, 184-93(2004).