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Microelectronics Reliability
Volumn 43, Issue 3, 2003, Pages 487-494
A simple and fundamental design rule for resisting delamination in bimaterial structures
Author keywords

[No Author keywords available]
Indexed keywords

AUTOCLAVES; DEPOSITION; ENCAPSULATION; INTEGRATED CIRCUITS; MICROELECTRONICS; PEELING; SEMICONDUCTING SILICON;
EID: 0037370259     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00317-7     Document Type: Conference Paper
Times cited : (25)
References (12)
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  • 3
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    • Suhir, E.1
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    • (1989) ASME J. Appl. Mech. , vol.56 , Issue.SEPTEMBER , pp. 595-600
    • Suhir, E.1
  • 5
    • 0345959892 scopus 로고
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    • (1990) ASME J. Electron Packaging , vol.112 , Issue.3 , pp. 16-23
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  • 6
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    • Interfacial thermal stresses in bimaterial beams: Modified beam models revisited
    • Ru C.Q. Interfacial thermal stresses in bimaterial beams: modified beam models revisited. ASME J Electron Packaging. 124(1):2002;141-146.
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    • Ru, C.Q.1
  • 7
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    • On the design of debond-resistant bimaterials - Part I: Free-edge singularity approach
    • Klingbeil N.W., Bueth J.L. On the design of debond-resistant bimaterials - Part I: free-edge singularity approach. Eng. Fract. Mech. 66:2000;93-110.
    • (2000) Eng. Fract. Mech. , vol.66 , pp. 93-110
    • Klingbeil, N.W.1    Bueth, J.L.2
  • 8
    • 0033736940 scopus 로고    scopus 로고
    • On the design of debond-resistant bimaterials - Part II: A comparison of free-edge and interface crack approaches
    • Klingbeil N.W., Bueth J.L. On the design of debond-resistant bimaterials - Part II: a comparison of free-edge and interface crack approaches. Eng. Fract. Mech. 66:2000;110-128.
    • (2000) Eng. Fract. Mech. , vol.66 , pp. 110-128
    • Klingbeil, N.W.1    Bueth, J.L.2
  • 9
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    • Effects of peeling stresses in a bimaterial assembly
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.