Thermomechanical peeling in multilayer beams and plates - A solution from first principles

International Journal of Solids and Structures

Volumn 42, Issue 1, 2005, Pages 271-285

  Moore, Thomas D ^a,b  

^a ANALOG DEVICES   (Ireland)

^b Thermomechanical Solutions   (Ireland)

Author keywords

Beam; Delamination; Layer; Peel; Plate; Stress

Indexed keywords

DELAMINATION; DIFFERENTIAL EQUATIONS; EIGENVALUES AND EIGENFUNCTIONS; PEELING; PLATES (STRUCTURAL COMPONENTS); STRESSES; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT; THERMOSTATS;

BIMATERIAL BEAMS; BIMETAL THERMOSTAT ANALYSIS; MULTILAYER BEAMS; PEELING STRESS;

BEAMS AND GIRDERS;

EID: 5644268093     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2004.07.013     Document Type: Article

References (15)

1. ANSYS 6.1, 2001. ANSYS Inc., Canonsburg, PA.
2. Boley, B.A., Testa, R.B., 1969. Thermal stresses in composite beams. International Journal of Solids and Structures (5), 1153-1169.
3. Chen, W.T., Nelson, C.W., 1979. Thermal stresses in bonded joints. IBM Journal of Research and Development (23), 179-188.
4. Eischen, J.W., Chung, C., Kim, J.H., 1990. Realistic modeling of edge effect stresses in bimaterial elements. ASME Journal of Electronic Packaging (112), 16-23.
5. Grimado, P.B., 1978. Interlaminar thermoelastic stresses in layered beams. Journal of Thermal Stresses (1), 75-86.
6. Hess, M.S., 1969a. The end problem for a laminated elastic strip-I. The general solution. Journal of Composite Materials (3), 262-280.
7. Hess, M.S., 1969b. The end problem for a laminated elastic strip-II. Differential expansion stresses. Journal of Composite Materials (3), 630-641.
8. Hsueh, C.H., 2002. Thermal stresses in elastic multilayer systems. Thin Solid Films (418), 182-188.
9. MathCAD 6.0 Std Ed. 1995. Mathsoft Engineering & Education, Inc., Cambridge, MA.
10. Moore, T.D., Jarvis, J.L., 2003. A simple and fundamental design rule for resisting delamination in bimaterial structures. Microelectronics Reliability (43), 487-494.
11. Pan, T.-Y., Pao, Y.-H., 1990. Deformation in multilayer stacked assemblies. ASME Journal of Electronic Packaging (112), 30-34.
12. Pao, Y.-H., Eisele, E., 1991. Interfacial shear and peel stresses in multilayered thin stacks subjected to uniform thermal loading. ASME Journal of Electronic Packaging (113), 164-172.
13. Ru, C.Q., 2002. Interfacial thermal stresses in bimaterial elastic beams: modified beam models revisited. ASME Journal of Electronic Packaging (124), 141-146.
14. Suhir, E., 1986. Stresses in bi-metal thermostats. ASME Journal of Applied Mechanics (53), 657-660.
15. Timoshenko, S., 1925. Analysis of bi-metal thermostats. Journal of the Optical Society of America (11), 233-255.