A stress-life methodology for ball grid array lead-free and tin-lead solder interconnects under impact conditions

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 277-284

  Heaslip, Greg M ^a   Punch, Jeff M ^a   Rodgers, Bryan A ^a   Ryan, Claire ^a   Reid, Michael ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

DATA ACQUISITION; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTRONIC EQUIPMENT; FINITE ELEMENT METHOD; LEAD; LIQUID CRYSTAL DISPLAYS; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SOLDERING; STRESS ANALYSIS;

ENERGY DISPERSIVE SPECTROSCOPY (EDS); FAILURE MECHANISMS; INFORMATION AND COMMUNICATION TECHNOLOGY (ICT) APPLICATIONS; TIN-LEAD SOLDER INTERCONNECTS;

FAILURE (MECHANICAL);

EID: 33745712153     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502814     Document Type: Conference Paper

References (19)

1. Wu, J., Guosho, S., Yeh, C., and Wyatt, K., 1998, "Drop/Impact Simulation and Test Validation of Telecommunication Products," Proceedings InterSociety Conference on Thermal Phenomena, pp. 330-336.
2. Suraski, D. and Seeling, K., 2001, "The Current Status of Lead-Free Solder Alloys", IEEE Electronic Packaging Manufacturing, Vol. 24:4, pp.244-248.
3. Suhir, E., 2002, "Could Shock Tests Adequately Mimic Drop Test Conditions," Proceedings Electronic Components and Technology Conference, pp. 563-573.
4. Suhir, E., 1996, "Dynamic Response of a One-Degree-of-Freedom Linear System to a Shock Load During a Drop Test: Effects of Viscous Damping," IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, 19, pp. 435-440.
5. Suhir, E., and Burke, R., 1994, "Dynamic Response of a Rectangular Plate to a Shock Load, With Application to Porable Electronic Products," IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B, 17-3, pp. 435-440.
6. Suhir, E., 1992, "Nonlinear Dynamic Response of a Flexible Printed Circuit Board to a Shock Load to its Support Contour," ASME Journal of Electronic Packaging, 114, pp. 368-377.
7. Suhir, E., 1997, "Is the Maximum Acceleration an Adequate Criterion of the Dynamic Strength of a Structural Element in an Electronic Product?" IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, 20, pp. 513-517.
8. Goyal, S., Papadopoulos, J. M., and Sullivan, P. A., 1998, "The Dynamics of Clattering 1: Equation of Motion and Examples," Journal of Dynamic Systems, Measurements, and Control, 120, pp. 83-93.
9. Goyal, S., Papadopoulos, J. M., and Sullivan, P. A., 1998, "The Dynamics of Clattering 2: Global Results and Shock Protection," Journal of Dynamic Systems, Measurements, and Control, 120, pp. 94-102.
10. Goyal, S., Papadopoulos, J. M., and Sullivan, P. A., 1997, "Shock Protection of Portable Electronic Products: Shock Response Spectrum, Damage Boundary Approach and Beyond," Shock and Vibration, 4-3, pp. 169-191.
11. Hirata, I., Yoshida, Y., and Morizaki, I., 2001, "Drop-Simulation of Electronic Boards Mounted with CSPs," NEC Res. & Develop., 42-3.
12. Wong, E. H. et al., 2002, "Drop Impact Test - Mechanics and Physics of Failure," Proceedings Electronic Components and Technology Conference, pp. 327-336.
13. Luan, J., Tee, T. Y., Pek, E., Lim, C. T., Zhong, Z., "Modal analysis and dynamic responses of board level drop test," Electronics Packaging Technology 5th Conference, pp. 233-243
14. Tee, T. Y., Ng, H. C., Lim, C. T., Pek, E., 2003, "Board level drop test and Simulation of TFBGA Packages for Telecommunication Applications," Proceedings ECTC, pp. 121-129.
15. th EPTC Conference, Singapore.
16. JEDEC Standard JESD22-B111, 2003, "Board Level Drop Test Method of Components for Handheld Electronic Products," July.
17. ReliaSoft, Weibull++ Version 6, 2000, "Life Data Analysis Reference," ReliaSoft Publishing.
18. Date, M. et al, "Impact Reliability of Solder Joints," Proc. IEEE ECTC, 2004, pp. 668-674.
19. Lin, J. K. et al., "Characterisation of Lead-Free Solders and Under Bump Matellurgies for Flip-Chip Package," Trans. IEEE Electronics Packaging Manufacturing, 2002, pp. 300-307.