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Surface and Interface Analysis

Volumn 24, Issue 2, 1996, Pages 127-132

XPS study of the oxidation behavior of the Cu3Sn intermetallic compound at low temperatures

(3) Wang, DongNing a Miller, Alfred C b Notis, Michael R a

a Lehigh University (United States)

b LEHIGH UNIVERSITY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; FILM GROWTH; OXIDATION; PHASE EQUILIBRIA; REACTION KINETICS; SOLDERING ALLOYS; TIN ALLOYS; WETTING; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER-TIN INTERMETALLIC COMPOUNDS; TEMPERATURE DEPENDENCE;

INTERMETALLICS;

EID: 0030080706 PISSN: 01422421 EISSN: None Source Type: Journal
DOI: 10.1002/(SICI)1096-9918(199602)24:2<127::AID-SIA110>3.0.CO;2-Z Document Type: Article

Times cited : (45)

References (10)

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4
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