Nano-imprint lithography: Templates, imprinting and wafer pattern transfer

Microelectronic Engineering

Volumn 83, Issue 4-9 SPEC. ISS., 2006, Pages 929-932

  Dauksher, W J ^a   Le, N V ^a   Ainley, E S ^a   Nordquist, K J ^a   Gehoski, K A ^a   Young, S R ^a   Baker, J H ^a   Convey, D ^a   Mangat, P S ^a  

^a MOTOROLA INC   (United States)

Author keywords

Imprinting; Mask patterning; Nano imprint lithography; Pattern transfer; Template

Indexed keywords

LABORATORIES; OPTIMIZATION; PRODUCT DEVELOPMENT; REPAIR; SEMICONDUCTOR MATERIALS; SILICON WAFERS;

IMPRINTING; MASK PATTERNING; NANO-IMPRINT LITHOGRAPHY; PATTERN TRANSFER; TEMPLATE;

LITHOGRAPHY;

EID: 33646034054     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.01.075     Document Type: Article

References (9)

1. International Technology Roadmap for Semiconductors, 2003 ed.
2. A. Hand, Infrastructure Steps Closer to EUV Lithography, Semiconductor International, September 1 2005.
3. Colburn M., Johnson S., Stewart M., Damle S., Bailey T., Choi B., Wedlake M., Michaelson T., Sreenivasan S.V., Ekerdt J., and Willson C.G. Proc. SPIE, Emerging Lithographic Technologies III 379 (1999)
4. Chou S.Y., Krauss P.R., and Renstrom P.J. J. Vac. Sci. Technol. B 14 6 (1996) 4129-4133
5. Resnick D.J., Sreenivasan S.V., and Grant Willson C. Mater. Today 8 2 (2005) 34
6. Dauksher W.J., Nordquist K.J., Mancini D.P., Resnick D.J., Baker J.H., Hooper A.E., Talin A.A., Bailey T.C., Lemonds A.M., Sreenivasan S.V., Ekerdt J.G., and Willson C.G. J. Vac. Sci. Technol. B 20 6 (2002) 2857-2861
7. Le N.V., Dauksher W.J., Gehoski K.A., Resnick D.J., Hooper A.E., Johnson S., and Willson G. Microelectron. Eng. 78-79 (2005) 464
8. Le N.V., Gehoski K.A., Dauksher W.J., Baker J.H., Resnick D.J., and Dues L. Proc. SPIE 5751 (2005) 219
9. Cardinale G.F., Skinner J.L., Talin A.A., Brocato R.W., Palmer D.W., Mancini D.P., Dauksher W.J., Gehoski K., Le N., Nordquist K.J., and Resnick D.J. J. Vac. Sci. Technol. B 22 6 (2004) 3265-3270