(Sn-Ag)eut + Cu Soldering Materials, Part II: Electrical and Mechanical Studies

Journal of Phase Equilibria and Diffusion

Volumn 25, Issue 2, 2004, Pages 122-124

  Kisiel, R ^a   Gasior W ^b   Moser, Z ^b   Pstrus J ^b   Bukat, K ^c   Sitek, J ^c  

^a WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^b INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

^c TELE AND RADIO RESEARCH INSTITUTE   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; EUTECTICS; PRINTED CIRCUIT BOARDS; SHEAR STRENGTH; SOLDERING; TENSILE STRENGTH; TERNARY SYSTEMS; WETTING;

CURRENT FLOW; ELECTRONIC ASSEMBLIES; JUMPER RESISTORS;

SOLDERING ALLOYS;

EID: 2142650719     PISSN: 15477037     EISSN: None     Source Type: Journal    
DOI: 10.1361/15477030418505     Document Type: Article

References (5)

1. Second European Lead-Free Soldering Roadmap, Soldertec, The Soldering Technology Centre, February 2003, www.lead-free.org.
2. eut + Cu Soldering Materials, Part I: Wettability Studies," J. Phase Equilibria Diffusion, 2004, 25(2), pp. 115-121.
3. Anon., Database for Solder Properties with Emphasis on New Lead-Free Solders, National Institute of Standards and Technology and Colorado School of Mines, Golden, Colorado, February 11, 2002.
4. B.A. Cook, I.E. Anderson, J.L. Harringa, and R.L. Terpstra: "Effect of Heat Treatment on the Electrical Resistivity of Near-Eutectic Sn-Ag-Cu Pb-free Solder Alloys," J. Electron. Mater., 2002, 31, pp. 1190-94.
5. R. Kisiel: "Resistivity of Lead-Free Solder Joints" in Proc. ISSE'98, 21st International Spring Seminar on Electronics Technology, Neusiedl am See, Austria, May 4-7, Institute of Materials Science for Electrical Engineering, Vienna University of Technology, Vienna, Austria, 1998, pp. 32-33.