Development of the green plastic encapsulation for high density wirebonded leaded packages

Microelectronics Reliability

Volumn 43, Issue 5, 2003, Pages 811-817

  Lin, T Y ^a,b   Fang, C M ^a   Yao, Y F ^a   Chua, K H ^a  

^a Agere Systems Singapore Pte Ltd   (Singapore)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIMONY; ELECTRONICS INDUSTRY; ENCAPSULATION; ENVIRONMENTAL PROTECTION; FLAME RETARDANTS; HALOGEN COMPOUNDS; LEAD; MOISTURE; PLASTICS APPLICATIONS; SHEET MOLDING COMPOUNDS;

HIGH DENSITY WIREBONDED PACKAGES;

CHIP SCALE PACKAGES;

EID: 0037651052     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00061-1     Document Type: Article

References (10)

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3. Manalac R., Cheah B., Alimagno J. Environmentally safe mold compound - evaluation of new flame retardants. Advanced Packaging. 2(November):2001;31-36.
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5. Dai-ichi, Centre Gate Molding on PBGA35-packaging development presentation, 17 May 2002.
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10. Tay AAO, Yeo KS, Wu JH. Wirebound deformation during molding of IC packages. ASME EEP, vol. 3, Advances in Electronic Packaging, 1993. p. 233-41.