The impact of multiple failure modes on estimating product field reliability

IEEE Design and Test of Computers

Volumn 23, Issue 2, 2006, Pages 118-126

  Carulli Jr , John M ^a   Anderson, Thomas J ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SYSTEM RECOVERY; DATA STRUCTURES; ESTIMATION; RELIABILITY THEORY;

MULTIPLE FAILURE MODES; RELIABILITY DEFECTS; RELIABILITY MODELING;

INTEGRATED CIRCUIT TESTING;

EID: 33645823407     PISSN: 07407475     EISSN: None     Source Type: Journal    
DOI: 10.1109/MDT.2006.53     Document Type: Article

References (6)

1. L. Wolstenholme, Reliability Modeling: A Statistical Approach, Chapman & Hall/CRC Press, 1999.
2. NIST/SEMATECH e-Handbook of Statistical Methods, http://www.itl.nist.gov/ div898/handbook/.
3. J.A. van der Pol et al., "Impact of Screening of Latent Defects at Electrical Test on the Yield-Reliability Relation and Application to Burn-in Elimination," Proc. Int'l Reliability Physics Symp., IEEE Press, 1998, pp. 370-377.
4. K.R. Forbes and P. Schani, "Characterization of the Time-Dependent Reliability Fallout as a Function of Yield for a 130-nm SRAM Device and Application to Optimize Production Burn-In," Proc. Int'l Reliability Physics Symp., IEEE Press, 2004, pp. 165-170.
5. W.C. Riordan et al., "Microprocessor Reliability Performance as a Function of Die Location for a 0.25-μm, Five Layer Metal CMOS Logic Process," Proc. Int'l Reliability Physics Symp., IEEE Press, 1999, pp. 1-11.
6. R. Madge et al., "Screening MinVDD Outliers Using Feed-Forward Voltage Testing," Proc. IEEE Int'l Test Conf. (ITC 02), IEEE CS Press, 2002, pp. 673-682.