Planar copper plating and electropolishing techniques

Chemical Engineering Communications

Volumn 193, Issue 7, 2006, Pages 903-915

  Başol, Bulent M ^a   Uzoh, C E ^a   Talieh, H ^a   Wang, T ^a   Guo, G ^a   Erdemli, S ^a   Cornejo, M ^a   Bogart, J ^a   Basol, E C ^a  

^a ASM NuTool Inc   (United States)

Author keywords

Copper; Electroplating; Electropolishing

Indexed keywords

ELECTRODEPOSITION; ELECTROLYTIC POLISHING; ELECTROPLATING; SUBSTRATES;

ELECTROCHEMICAL MECHANICAL DEPOSITION (ECMD); PLANAR CONDUCTIVE FILMS;

COPPER PLATING;

COPPER PLATING; ELECTRODEPOSITION; ELECTROLYTIC POLISHING; ELECTROPLATING; SUBSTRATES;

EID: 33645227243     PISSN: 00986445     EISSN: 15635201     Source Type: Journal    
DOI: 10.1080/00986440500267410     Document Type: Article

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