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27-28 February
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3
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Semiconductor defect classification using hyperellipsoid clustering neural networks and model switching
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Estimating cross-section semiconductor structure by comparing top-down SEM images
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Machine Vision Applications in Industrial Inspection XI
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Jeffery R. Price, Philip R. Bingham, Kenneth W. Tobin, Jr., Thomas P. Karnowski, "Estimating cross-section semiconductor structure by comparing top-down SEM images", Machine Vision Applications in Industrial Inspection XI (Proc. SPIE/IS&T Vol. 5011), pp.161-170, 2003
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Modeling, measurement, and standards for wafer inspection
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George W. Mulholland and Thomas A. Germer, "MODELING, MEASUREMENT, AND STANDARDS FOR WAFER INSPECTION", Proc. the Government Microcircuits Applications and Critical Technologies (GOMACTech) Conference, March 31 to April 3, 2003
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Physical Review Letters
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From micro to nano: Recent advances in high-resolution microscopy
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Super-resolution bright-field optical microscopy based on nanometer topographic contrast
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