Numerical and experimental correlation of high temperature reliability of gold wire bonding to intermetallics (Au/Al) uniformity

Thin Solid Films

Volumn 504, Issue 1-2, 2006, Pages 355-361

  Zhang, Xueren ^a   Tee, Tong Yan ^a  

^a STMICROELECTRONICS   (Singapore)

Author keywords

High temperature storage; Intermetallics; Modeling; Wire bond

Indexed keywords

COMPUTER SIMULATION; FAILURE (MECHANICAL); INTERMETALLICS; MATHEMATICAL MODELS; TENSILE STRESS; WIRE;

GOLD BONDS; HIGH TEMPERATURE STORAGE; THERMO-MECHANICAL STRESS; WIRE BONDS;

BONDING;

EID: 33644881621     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.121     Document Type: Conference Paper

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