Semiconductors in high temperature applications - A future trend in automotive industry

Microelectronics Reliability

Volumn 44, Issue 9-11 SPEC. ISS., 2004, Pages 1413-1417

  Goroll, Michael ^a   Pufall, Reinhard ^a   Kanert, Werner ^a   Plikat, Boris ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE APPLICATIONS; LARGE SCALE SYSTEMS; LEAKAGE CURRENTS; MATHEMATICAL MODELS; MICROCONTROLLERS; PROBABILITY; SEMICONDUCTOR MATERIALS;

ARRHENIUS MODELS; AUTOMOTIVE ELECTRONIC COUNCIL (AEC); DEEP SLEEP CURRENTS; ELECTRICAL CONTROL UNITS (ECU);

AUTOMOTIVE INDUSTRY;

EID: 4544320324     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.07.032     Document Type: Conference Paper

References (7)

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7. Alpern et al.: Studies on Parameters for Popcorn Cracking, Polytronic 2001, Potsdam