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Volumn 3, Issue 6, 2003, Pages 14-18
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Selection criteria for X-ray inspection systems for BGA and CSP solder joint analysis
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Author keywords
2D; 3D; Laminography; X ray inspection
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Indexed keywords
ASSEMBLY;
CHIP SCALE PACKAGES;
CUSTOMER SATISFACTION;
DETECTORS;
FLIP CHIP DEVICES;
IMAGE ANALYSIS;
IMAGING TECHNIQUES;
INFORMATION ANALYSIS;
INVESTMENTS;
PRINTED CIRCUIT BOARDS;
SEMICONDUCTOR DEVICES;
X RAY TUBES;
X RAYS;
AREA ARRAY PACKAGES;
SOLDER BALLS;
X-RAY IMAGING TECHNIQUES;
X-RAY INSPECTION SYSTEMS;
SOLDERED JOINTS;
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EID: 2942701955
PISSN: 14740893
EISSN: None
Source Type: Journal
DOI: None Document Type: Review |
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Times cited : (1)
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References (1)
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