Double-tensural bistable mechanisms (DTBM) with on-chip actuation and spring-like post-bistable behavior

Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference - DETC2005

Volumn 7 A, Issue , 2005, Pages 537-546

  Wilcox, Daniel L ^a   Howell, Larry L ^b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b Brigham Young University   (United States)

Author keywords

Bistable mechanisms; Compliant mechanisms; MEMS; Microelectromechanical systems; Thermal on chip actuation

Indexed keywords

ACTUATORS; FINITE ELEMENT METHOD; LINEAR SYSTEMS; MICROELECTROMECHANICAL DEVICES; TENSILE TESTING; THERMOANALYSIS;

BISTABLE MECHANISMS; COMPLIANT MECHANISMS; THERMAL ON-CHIP ACTUATION;

MECHANICAL ENGINEERING;

EID: 33244471317     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/detc2005-84697     Document Type: Conference Paper

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