Experimetnal characterization of bonded microcoolers for hot spot removal

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART C, Issue , 2006, Pages 2185-2193

  Zhang, Yan ^a   Hoffman, Christine ^b   Wang, Peng ^c   Zeng, Gehong ^d   Shakouri, Ali ^a   Bar Cohen, Avram ^c  

^a University of California Santa Cruz   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c UNIVERSITY OF MARYLAND   (United States)

^d University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING POWER DENSITY (CPD); COOLING TEMPERATURE; EXPERIMETNAL CHARACTERIZATION; HOT SPOT REMOVAL; MICROCOOLERS;

BONDING; CHARACTERIZATION; MICROELECTROMECHANICAL DEVICES; MICROPROCESSOR CHIPS; SILICON COMPOUNDS; SUBSTRATES; SUPERLATTICES;

COOLING SYSTEMS;

EID: 32844465704     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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