Superlattice microrefrigerators flip-chip bonded with optoelectronic devices

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 20, Issue , 2004, Pages 190-197

  Zhang, Yan ^a   Zeng, Gehong ^a   Piprek, Joachim ^b   Bar Cohen, Avram ^c   Shakouri, Ali ^a  

^a University of California Santa Cruz   (United States)

^b University of California   (United States)

^c UNIVERSITY OF MARYLAND   (United States)

Author keywords

Cooling power density; Electrothermal simulation; Integration; Maximum cooling; Microrefrigerators; Superlattice

Indexed keywords

COOLING POWER DENSITY; ELECTROTHERMAL SIMULATION; MAXIMUM COOLING; MICROREFRIGERATORS;

COMPUTER SIMULATION; COOLING; ELECTRIC CURRENTS; FLIP CHIP DEVICES; HEATING; INTEGRATION; OPTIMIZATION; REFRIGERATORS; SEMICONDUCTING INDIUM PHOSPHIDE; SUPERLATTICES; THIN FILMS;

OPTOELECTRONIC DEVICES;

EID: 2342533698     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)

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