3D electrothermal simulation of heterostructure thin film micro-coolers

American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) AES

Volumn 43, Issue , 2003, Pages 39-48

  Zhang, Yan ^a   Vashaee, Daryoosh ^a   Christofferson, James ^a   Shakouri, Ali ^a   Zeng, Gehong ^b   Labounty, Chris ^b   Piprek, J ^b   Croke, Ed ^c  

^a University of California Santa Cruz   (United States)

^b University of California   (United States)

^c Hughes Aircraft Co   (United States)

Author keywords

Electrothermal; Heterostructure; Micro cooler; Modeling, optimization; Si sige superlattice; Thermoelectric thermionic cooling

Indexed keywords

COMPUTER SIMULATION; HEAT RESISTANCE; HETEROJUNCTIONS; MICROPROCESSOR CHIPS; OPTIMIZATION; SUPERLATTICES; THERMOELECTRICITY; THIN FILMS;

THERMIONIC COOLING; THERMOELECTRIC (TE) MATERIALS;

COOLING SYSTEMS;

EID: 1842479309     PISSN: 10716947     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-42767     Document Type: Conference Paper

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