Assessments of single-phase liquid cooling enhancement techniques for microelectronics systems

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART A, Issue , 2005, Pages 43-50

  Zhang, H Y ^a   Pinjala, D ^a   Iyer, M K ^a   Nagarajan, R ^a   Joshi, Y K ^b   Wong, T N ^c   Toh, K C ^c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Enhancement structure; Liquid cooling; Metallic foam; Microchannels; Pressure drop; Thermal resistance

Indexed keywords

COOLING; HEAT SINKS; MICROSTRUCTURE; PRESSURE DROP; SILICON;

ENHANCEMENT STRUCTURE; LIQUID COOLING; METALLIC FOAM; MICROCHANNELS;

HEAT RESISTANCE;

EID: 32844458217     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (21)

1. Assembly and Packaging, ITRS Roadmap 2001, 4-8.
2. R.C. Chu, Thermal management roadmap cooling electronic products from handheld device to supercomputers, MIT Rohsenow Symposium, May 2002, Cambridge, MA.
3. D. B. Tuckerman and R. F. W. Pease, High-performance heat sinking for VLSI, IEEE Electronics Device Letter, EDL-2; 1981, 126-129.
4. C. Perret, J. Boussey, C. Schaeffer and M. Coyaud, Analytic modeling, optimization, and realization of cooling devices in Silicon technology, IEEE Trans. Components and Packaging Technologies 23; 2000, 665-672.
5. P. S. Lee, J. C Ho and H. Xue, Experimental study on laminar heat transfer in microchannel heat sink, Proc. of 8th ITHERM; 2002, 379-386, San Diego.
6. W. Qu and I. Mudawar, Experimental and numerical studies of pressure drop and heat transfer in a single-phase microchannel heat sink, Int. J. Heat Mass Transfer 45; 2002, 2549-2565.
7. H. Y. Zhang, D. Pinjala, Y. K. Joshi, T. N. Wong and K. C. Toh, "Thermal modeling and design of liquid cooled heat sinks assembled with flip chip ball grid array packages", ECTC 2003, 431-437, New Orleans.
8. H.Y. Zhang, D. Pinjala, Y.K. Joshi, T.N. Wong, "Development of Liquid Cooling Techniques for Flip Chip Ball Grid Array Packages with High Heat Flux Dissipations", IEEE Trans. Comp. Packaging Technol. 28; 2005, pp.127-135.
9. C. B. Sobhan and S. V. Garimella, A comparative analysis of studies on heat transfer and fluid flow in microchannels, Microscale Thermophysical Engineering 5; 2001, 293-311.
10. B. Palm, Heat transfer in microchannels, Microscale Thermophysical Engineering 5; 2001, 155-175.
11. G. E. Kendall, P. Griffith, A. E. Bergles and J. H. Lienhard V, Small diameter effects on internal flow boiling, Proceedings of ASME 2001 IMECE, 1-17, New York.
12. G. P. Peterson, and C. S. Chang, "Two-phase heat dissipation utilizing porous-channels of high-conductivity material", J. Heat Transfer 120; 1998, 243-252.
13. V. V. Calmidi and R. L. Mahajan, "Forced convection in high porosity metal foams", J. Heat Transfer 122; 2000, 557-565.
14. H.Y. Zhang, D. Pinjala, Y.K. Joshi, T.N. Wong, K.C. Toh, "Fluid flow and heat transfer characteristics of liquid cooled foam heat sinks", Proc. of 9th ITHERM; 2004, 640-647,Las Vegas.
15. K. Boomsma, D. Poulikakos and F. Zwick, "Metal foams as compact high performance heat exchangers", Mechanics of Materials 35; 2003, pp.1161-1176.
16. D. P. Haack, K. R. Butcher, T. Kim and T. J. Lu, "Novel lightweight metal foam heat exchangers", ASME IMECE, Proceeding V.3; 2001, New York.
17. J. Comyn, Adhesion Science, The Royal Society of Chemistry, 1997.
18. Integrated circuits thermal measurement method - Electrical test method (single semiconductor device), JEDEC Standard 51-1, Dec., 1995.
19. D. Copeland, Optimization of parallel plate heat sinks for forced convection, Proceedings of 16th IEEE SEMI-THERM Symposium; 2000, 266-272, San Jose.
20. W. M. Kays and A. L. London, "Compact heat exchangers", 3rd Ed., 1984, McGraw-Hill, New York.
21. R. K. Shah, A. L. London, Laminar flow forced convection in ducts, in Handbook of single-phase convective heat transfer; 1987, pp. 3.52, John Wiley & Sons.