Optimization of process parameters in manufacturing: An approach of multiple attribute decision making

Transactions of the North American Manufacturing Research Institute of SME

Volumn 33, Issue , 2005, Pages 187-194

  Sun, W P ^a   Pel, Z J ^a   Lee, E S ^a   Fisher, G R ^b  

^a Kansas State University   (United States)

^b MEMC Electronic Materials Inc   (United States)

Author keywords

ELECTRE; Grinding; Multi attribute decision making (MADM); Process Parameter Selection; Silicon wafer

Indexed keywords

ELECTRE; MULTI-ATTRIBUTE DECISION-MAKING (MADM); PROCESS PARAMETER SELECTION;

DECISION MAKING; GRINDING (MACHINING); MANUFACTURE; SILICON WAFERS;

PROCESS CONTROL;

EID: 32844458031     PISSN: 10473025     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)

1. Belton, V., and T. Gear, (1983), "On a Short-Coming of Saaty's Method of Analytic Hierarchies," Omega, pp. 228-230.
2. Chen, S.J., and C.L. Hwang, (1992), "Fuzzy Multiple Decision Making: Methods and Applications," Lecture Notes in Economics and Mathematical Systems, No. 375, Springer-Verlag, Berlin, Germany.
3. Elsayed, E.A., and A. Chen, (1993), "Optimal Levels of Process Parameters for Products with Multiple Characteristics," International Journal of Production Research, Vol. 31, No. 5, pp1117-1132.
4. Greenall, R., (1989), "A Taguchi Optimization of the Manufacturing Process for an Injection Molded Housing," Taguchi Methods: Applications in World Industry, A. Bendell, J. Disney and W.A. Pridmore, Eds. New York: IFS Publications and Springer-Verlag.
5. Hwang, C.L., and K. Yoon, (1981), Multiple attribute decision making: methods and applications, Berlin/Heidelberg/New-York: Springer Verlag.
6. Jiao, Y., J. Wu, S. Lei, Z.J. Pei, and S. Lee, (2003), "Application of Fuzzy Adaptive Networks in Manufacturing: Waviness Removal in Grinding of Wire-sawn Silicon Wafers," CD-ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2003 (IMECE 2003), Washington, DC, November 16-21.
7. Karpak, B., and S. Zionts, editors, (1989), Multiple Criteria Decision Making and Risk Analysis Using Microcomputers, Springer Verlag.
8. Kassir, S.M., and T.A. Walsh, (1999), "Grinding Process and-Apparatus for Planarizing Sawed Wafers," U.S. Patent 5,964,646, Oct. 12, 1999.
9. Liu, W., Z.J. Pei, and X.J. Xin, (2002), "Finite Element Analysis for Grinding and Lapping of Wire-sawn Silicon Wafers," Journal of Materials Processing Technology, Vol. 129, No. 1-3, pp. 2-9.
10. Lootsma, F.A., T.C.A. Mensch, and F.A. Vos, (1990), "Multi-criteria Analysis and Budget Reallocation in Long-term Research Planning," European Journal of Operational Research, Vol. 47, pp. 293-305.
11. Mayers, R.H., A.I. Khuri, and W.H. Carter, (1989), "Response Surface Methodology: 1966-1988," Technometrics, Vol. 31, pp. 137-157.
12. Pei, Z.J., X.J. Xin, and W.J. Liu, (2003), "Finite Element Analysis for Grinding of Wire-sawn Silicon Wafers: A Designed Experiment," International Journal of Machine Tools and Manufacture, Vol. 43, No. 1, pp. 7-16.
13. Phadke, M.D., (1989), Quality Engineering Using Robust Design, Englewood Cliffs, NJ: Prentice-Hall.
14. Roy, B., (1973), "How the Outranking Relation Helps Multiple Criteria Decision Making," Multiple Criteria Decision Making, Cochrane and Zeleny (Eds.), University of South Carolina Press, SC, pp. 179-201.
15. Roy, B., (1990), "Decision-aid and Decision-Making," European Journal of Operational Research, Vol. 45, pp. 324-331.
16. Saaty, T.L., 1980, The Analytic Hierarchy Process, McGraw-Hill International, New York, NY.
17. Simpson, L., (1996), "Do Decision Makers Know What They Prefer?: MAVT and ELECTRE," Journal of the Operational Research Society, Vol. 47, pp. 919-929.
18. Sun, X.K., Z.J. Pei, X.J. Xin, and M. Fouts, (2004), "Waviness Removal in Grinding of Wiresawn Silicon Wafers: 3D Finite Element Analysis with Designed Experiments," International Journal of Machine Tools and Manufacture, Vol. 44, No. 1, pp. 11-19.
19. Triantaphyllou, E., B. Shu, S.N. Sanchez, and T. Ray, (1998), Encyclopedia of Electrical and Electronics Engineering, (J.G. Webster, Ed.), John Wiley & Sons, New York, NY, Vol. 15, pp. 175-186.
20. Triantaphyllou, E., (2000), Multi-criteria Decision Making Methods: A Comparative Study, Kluwer Academic Publishing, Dordrecht/Boston/London.
21. 5 Factorial Design," CD-ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC-2003), Portland, Oregon, May 18-20, 2003.
22. Xin, X.J., X.K. Sun, and Z.J. Pei, (2003), "Finite Element Analysis on Waviness Removal in Grinding of 300 mm Silicon Wafers," Proceedings of the International Conference on Leading Edge Manufacturing in 21th Century (LEM21), Niigata, Japan, November 3-6, 2003.
23. Xin, X.J., Z.J. Pei, and W.J. Liu, (2004), "Finite Element Analysis on Soft-pad Grinding of Wiresawn Silicon Wafers," Journal of Electronic Packaging, Vol. 126, No. 2, pp. 177-185.