Potential of Cat-CVD deposited a-SiC:H as diffusion barrier layer on low-k HSQ films for ULSI

Thin Solid Films

Volumn 501, Issue 1-2, 2006, Pages 318-321

  Singh, Sunil Kumar ^a   Kumbhar, Alka A ^a   Kothari, Mayur ^a   Dusane, R O ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY BOMBAY   (India)

Author keywords

a SiC:H barrier layer; Cu diffusion; HSQ; Low k dielectrics

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELECTRODES; HYDROGEN; METALLIZING; PARAFFINS;

A-SIC:H BARRIER LAYER; CU DIFFUSION; HSQ; LOW-K DIELECTRICS;

THIN FILMS;

EID: 32644474213     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.07.215     Document Type: Conference Paper

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