New millimeter-wave IC on Si substrate using MBB technology

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1995, Pages 56-59

  Yoshida, Takayuki ^a   Fujimoto, Hiroaki ^a   Hatada, Kenzo ^a   Ikeda, Yoshito ^a   Takahashi, Kazuaki ^a   Fujita, Suguru ^a   Sagawa, Morikazu ^a   Sakai, Hiroyuki ^a   Inoue, Kaoru ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); BONDING; EQUIVALENT CIRCUITS; HETEROJUNCTION BIPOLAR TRANSISTORS; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; MICROSTRIP LINES; MILLIMETER WAVE DEVICES; SEMICONDUCTING SILICON; SUBSTRATES;

MICRO BUMP BONDING; SILICON SUBSTRATES;

HYBRID INTEGRATED CIRCUITS;

EID: 0029453137     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)