On the determination of thermal expansion coefficient of thermal oxide

2005 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2005 Technical Proceedings

Volumn , Issue , 2005, Pages 339-342

  Tsou, C ^a   Huang, Y S ^a   Chang, H C ^a  

^a Electrical Engineering Department   (Taiwan)

Author keywords

Buckling deformation; Finite element analysis; Microbridge; Thermal expansion coefficient; Thermal oxide film

Indexed keywords

FINITE ELEMENT METHOD; MICROELECTRONICS; MICROSCOPES; OPTICAL PROPERTIES; SEMICONDUCTOR DEVICES; THERMODYNAMICS;

BUCKLING DEFORMATION; MICROBRIDGE; THERMAL EXPANSION COEFFICIENT; THERMAL OXIDE FILM;

THIN FILMS;

EID: 32044464355     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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