Low temperature deposition of metal films by metal chloride reduction chemical vapor deposition

Surface and Coatings Technology

Volumn 200, Issue 10 SPEC. ISS., 2006, Pages 3347-3350

  Ogura, Yuzuru ^a   Kobayashi, Chikako ^b   Ooba, Yoshiyuki ^a   Yahata, Naoki ^a   Sakamoto, Hitoshi ^a  

^a MITSUBISHI HEAVY INDUSTRIES LTD   (Japan)

^b HITEC Co Ltd   (Japan)

Author keywords

Chlorine; CVD; Plasma; Reduction

Indexed keywords

CHLORINE COMPOUNDS; FILMS; IRIDIUM; LOW TEMPERATURE EFFECTS; PROTECTIVE COATINGS; REDUCTION; TANTALUM COMPOUNDS; TITANIUM; X RAY DIFFRACTION ANALYSIS;

DEPOSTION MECHANISM; LOW TEMPERATURE DEPOSITION; METAL CHLORIDE REDUCTION CHEMICAL VAPOR DEPOSITION;

PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

CHLORINE COMPOUNDS; FILMS; IRIDIUM; LOW TEMPERATURE EFFECTS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PROTECTIVE COATINGS; REDUCTION; TANTALUM COMPOUNDS; TITANIUM; X RAY DIFFRACTION ANALYSIS;

EID: 31644445570     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.07.050     Document Type: Article

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