메뉴 건너뛰기




Volumn 151, Issue 3, 2004, Pages

A Method for Copper Film Deposition with Cl2 Plasma

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; CHEMICAL VAPOR DEPOSITION; CHLORINE; ELECTRIC CONDUCTIVITY; ELECTRON MICROSCOPY; ETCHING; EVAPORATION; FIELD EMISSION MICROSCOPES; FILM GROWTH; PLASMAS; SECONDARY ION MASS SPECTROMETRY; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 1842478660     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1645264     Document Type: Article
Times cited : (12)

References (14)
  • 2
    • 0002626228 scopus 로고
    • J. M. Poatc, K. N. Tu, and J. W. Mayer, Editors, Wiley-Interscience, New York
    • F. M. D'Heurle and P. S. Ho, in Thin Films - Interdiffusion and Reactions, J. M. Poatc, K. N. Tu, and J. W. Mayer, Editors, p. 243, Wiley-Interscience, New York (1978).
    • (1978) Thin Films - Interdiffusion and Reactions , pp. 243
    • D'Heurle, F.M.1    Ho, P.S.2
  • 3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.