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Volumn 151, Issue 3, 2004, Pages
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A Method for Copper Film Deposition with Cl2 Plasma
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Author keywords
[No Author keywords available]
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Indexed keywords
ADSORPTION;
CHEMICAL VAPOR DEPOSITION;
CHLORINE;
ELECTRIC CONDUCTIVITY;
ELECTRON MICROSCOPY;
ETCHING;
EVAPORATION;
FIELD EMISSION MICROSCOPES;
FILM GROWTH;
PLASMAS;
SECONDARY ION MASS SPECTROMETRY;
X RAY DIFFRACTION ANALYSIS;
X RAY PHOTOELECTRON SPECTROSCOPY;
COPPER FILMS;
FIELD EMISSION SECONDARY ELECTRON MICROSCOPY (FESEM);
COPPER;
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EID: 1842478660
PISSN: 00134651
EISSN: None
Source Type: Journal
DOI: 10.1149/1.1645264 Document Type: Article |
Times cited : (12)
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References (14)
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