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Journal of the Electrochemical Society

Volumn 151, Issue 3, 2004, Pages

A Method for Copper Film Deposition with Cl2 Plasma

(5) Sakamoto, H a Ogura, Y a Ooba, Y a Nishimori, T a Yahata, N a

a MITSUBISHI HEAVY INDUSTRIES LTD (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; CHEMICAL VAPOR DEPOSITION; CHLORINE; ELECTRIC CONDUCTIVITY; ELECTRON MICROSCOPY; ETCHING; EVAPORATION; FIELD EMISSION MICROSCOPES; FILM GROWTH; PLASMAS; SECONDARY ION MASS SPECTROMETRY; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER FILMS; FIELD EMISSION SECONDARY ELECTRON MICROSCOPY (FESEM);

COPPER;

EID: 1842478660 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.1645264 Document Type: Article

Times cited : (12)

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