Metal Chloride Reduction Chemical Vapor Deposition for Ta, Mo and Ir Films

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 43, Issue 1 A/B, 2004, Pages

  Ogura, Yuzuru ^a   Kobayashi, Chikako ^b   Ooba, Yoshiyuki ^a   Sakamoto, Hitoshi ^a   Yahata, Naoki ^a   Nishimori, Toshihiko ^a  

^a MITSUBISHI HEAVY INDUSTRIES LTD   (Japan)

^b HITEC Co Ltd   (Japan)

Author keywords

Chlorides; CVD; Iridium; Molybdenum; Plasma; Tantalum

Indexed keywords

CHEMICAL VAPOR DEPOSITION; CHLORINE; COPPER; IGNITION; IRIDIUM; LOW TEMPERATURE EFFECTS; MOLYBDENUM; PLASMAS; SCANNING ELECTRON MICROSCOPY; TANTALUM; ULSI CIRCUITS; VAPOR PRESSURE; X RAY PHOTOELECTRON SPECTROSCOPY;

METAL CHLORIDE REDUCTION; REDUCING AGENTS;

THIN FILMS;

EID: 1842759645     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.43.L56     Document Type: Article

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