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Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 42, Issue 11, 2003, Pages 6820-6822

Structural Evaluation of Cu Films Grown by Cl2 Plasma

(6) Ohba, Yoshiyuki a Sakamoto, Hitoshi a Ogura, Yuzuru a Yahata, Naoki a Nishimori, Toshihiko a Hatayama, Kenichiro b

a MITSUBISHI HEAVY INDUSTRIES LTD (Japan)

b World Intec Co Ltd (Japan)

Author keywords

Chemical vapor deposition; Chloride; Copper; Cvd; Plasma; Reduction; Structure

Indexed keywords

BACKSCATTERING; CHEMICAL VAPOR DEPOSITION; CHLORINE; ELECTRON SCATTERING; FIELD EMISSION MICROSCOPES; FILM GROWTH; GRAIN SIZE AND SHAPE; METALLIC FILMS; MORPHOLOGY; PLASMAS; SCANNING ELECTRON MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; SURFACE PHENOMENA; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

ELECTRON BACKSCATTERING PATTERN ANALYZERS; SURFACE MIGRATION;

COPPER;

EID: 1642536433 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/jjap.42.6820 Document Type: Article

Times cited : (5)

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