Effects of underfill encapsulant on the mechanical and electrical performance of a functional flip chip device

IEEE International Symposium on Polymeric Electronics Packaging, PEP

Volumn , Issue , 1997, Pages 265-272

  Lau, John ^a   Chang, Chris ^a   Chen, Ray ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; ELASTIC MODULI; ENCAPSULATION; EPOXY RESINS; FLIP CHIP DEVICES; GLASS TRANSITION; PLASTICS FILLERS; SOLDERING; SUBSTRATES; THERMAL EXPANSION;

SOLDER BUMPS; THERMAL EXPANSION COEFFICIENT;

ELECTRONICS PACKAGING;

EID: 0031387842     PISSN: 14029855     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (24)