Effects of the n+ etching process in TFT-LCD fabrication for Mo/Al/Mo data lines

Semiconductor Science and Technology

Volumn 19, Issue 7, 2004, Pages 839-845

  Choe, HeeHwan ^a   Kim, Sang Gab ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINUM; ETCHING; INTERCONNECTION NETWORKS; LIQUID CRYSTAL DISPLAYS; MAGNETRON SPUTTERING; THIN FILMS;

DATA LINES; INTERCONNECTS; PATTERNING PROCESSES;

MOLYBDENUM;

EID: 3142660334     PISSN: 02681242     EISSN: None     Source Type: Journal    
DOI: 10.1088/0268-1242/19/7/010     Document Type: Article

References (8)

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5. Liu R, Pai C S and Martinez E 1999 Solid State Electron. 43 1003
6. Choi Y, Kim S, Kwak W, Cho K and Jang J 1999 J. Korean Phys. Soc. 35 S1097
7. Takechi K, Hirando N, Hayama H and Kaneto S 1998 J. Appl. Phys. 84 3993
8. Lucovsky G 1999 IBM J. Res. Develop. 43 301