Mechanism and prevention of spontaneous tin whisker growth

Materials Transactions

Volumn 46, Issue 11, 2005, Pages 2300-2308

  Tu, King Ning ^e   Suh, Jong Ook ^a   Wu, Albert Tzu Chia ^b   Tamura, Nobumichi ^c   Tung, Chih Hang ^d  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^c LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^d INSTITUTE OF MICROELECTRONICS   (Singapore)

^e NONE

Author keywords

Lead free; Spontaneous growth; Tin whisker; X ray microdiffraction

Indexed keywords

COMPRESSIVE STRESS; COPPER; CRYSTAL WHISKERS; DIFFUSION; GRAIN BOUNDARIES; LEAD; SOLDERING ALLOYS; X RAY DIFFRACTION;

LEAD-FREE; SPONTANEOUS GROWTH; TIN WHISKER; X-RAY MICRODIFFRACTION;

TIN;

EID: 30844462797     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.46.2300     Document Type: Review

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