Fabrication methods for improved electromechanical behavior in piezoelectric membranes

Materials Research Society Symposium Proceedings

Volumn 872, Issue , 2005, Pages 419-424

  Robinson, M C ^a   Hayenga, P D ^a   Cho, J H ^a   Richards, C D ^a   Richards, R F ^a   Bahr, D F ^a  

^a WASHINGTON STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPACTION; FABRICATION; LEAD COMPOUNDS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MICROSTRUCTURE; RESIDUAL STRESSES; SILICA; THIN FILMS;

ELECTROMECHANICAL COUPLINGS; PIEZOELECTRIC MEMBRANES;

PIEZOELECTRIC MATERIALS;

EID: 30644475858     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-872-j18.26     Document Type: Conference Paper

References (9)

1. E. Hausler, L. Stein, Ferroelectronics 60 (1984) p. 277-282.
2. J. Kymissis, C. Kendall, J. Paradiso, N. Gershenfeld, Proceedings: Second IEEE International Conference on Wearable Computing, (1998) p. 132-139.
3. S. Whalen, M. Thompson, D.F. Bahr, C.D. Richards, R.F. Richards, Sensors and Actuators A104 (2003) p. 290-298.
4. L.M.R. Eakins, B.W. Olson, C.D. Richards, R.F. Richards, D.F. Bahr, Thin Solid Films 441 (2003) p. 180.
5. E. Bonnotte, P. Delobelle, L. Bornier, Journal of Materials Research 12, (1997) p.2234-2248
6. J. Cho, J. Raupp, M. Andersen, R. Richards, D. Bahr, C. Richards, Submitted to the Journal of Micromechanics and Microengineering, (2005).
7. M.S. Kennedy, A.L. Olson, J.C. Raupp, N.R. Moody, D.F. Bahr, Microsystem Technologies Journal, Article In Press (2005).
8. J. Cho, MS Thesis, Washington State University, 2004.
9. A. Degen, N. Abedinov, T. Gotszalk, E. Sossna, M. Kratzenberg, I.W. Rangelow, Microelectronic Engineering 57-58 (2001) p. 425-432.