High planarization efficiency and wide process window using electro-chemical mechanical planarization (Ecmp™)

Materials Research Society Symposium Proceedings

Volumn 867, Issue , 2005, Pages 87-96

  Liu, Feng Q ^a   Chen, Liang ^a   Duboust, Alain ^a   Tsai, Stan ^a   Manens, Antoine ^a   Wang, Yan ^a   Hsu, Wei Yung ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRIC CHARGE; SILICON WAFERS; THIN FILMS;

ELECTROCHEMICAL REMOVAL; PLANARIZATION EFFICIENCY;

ELECTROCHEMISTRY;

EID: 30544448863     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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