Measurement of Interfacial Adhesion and its Degradation in Multi-layer Packages, Devices, and Blanket Films using the Laser Spallation Technique

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2000, Pages 25-33

  Gupta, Vijay ^a   Hernandez, Robert ^a   Dias, Rajen ^b   Atluri, Vasudeva ^b   Raiser, George ^b   Mello, Mike ^b   Skoglund, Lars ^b   Zimmerman, Paul ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COMPRESSIVE STRESS; COMPUTER SIMULATION; DEGRADATION; DELAMINATION; DIELECTRIC FILMS; HYDROGEN BONDS; INTERFACES (MATERIALS); INTERFEROMETRY; LASER BEAMS; PHOTODIODES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASTIC DEFORMATION; TENSILE STRENGTH; TENSILE STRESS;

LASER SPALLATION TECHNIQUES; MULTI-LAYER PACKAGES; WAVE MECHANICS SIMULATION;

THIN FILMS;

EID: 1542270852     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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