Laser spallation adhesion metrology for electronic packaging development

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 192-198

  Miller, Mikel R ^a   Mello, Michael C ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; FLIP CHIP DEVICES; LASER PULSES; STRESSES;

LASER SPALLATION (LS);

ELECTRONICS PACKAGING;

EID: 0036296065     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Measurement of interface strength by the modified laser spallation technique. I. Experiment and simulation of the spallation process
2. Measurement of interface strength by the modified laser spallation technique. II. Applications to metal/ceramic interfaces
3. Structure and chemistry of Nb/sapphire interfaces with and without interlayers of Sb and Cr
4. Recent developments in the laser spallation technique to measure the interface strength and its relationship to interface toughness with applications to metal/ceramic, ceramic/ceramic and ceramic/polymer interfaces
5. Laser interferometry for measuring high velocities of any reflecting surface
6. Analysis of the laser velocity interferometer
7. Multi-point interferometer for monitoring two dimensional wave motion
8. Interference phenomena in a new form of refractometer
9. A variable displacement sensitivity interferometer with application to wave propagation experiments
10. Interferometer technique for measuring the dynamic mechanical properties of materials