Evaluation of Package Defects by Thermal Imaging Techniques

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2002, Pages 139-144

  Liu, Yongmei ^a   Dias, Rajen ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT CONDUCTION; HIGH SPEED CAMERAS; INFRARED DETECTORS; NONDESTRUCTIVE EXAMINATION; TEMPERATURE DISTRIBUTION; THERMOGRAPHY (IMAGING);

STEADY STATES; SURFACE THERMAL RESPONSE;

ELECTRONICS PACKAGING;

EID: 1542360117     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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