Accurate de-embedding of the contribution of the test boards to the high-frequency characteristics of backplane connectors

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1997, Pages 177-180

  Sercu, Stefaan ^a   Martens, Luc ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC NETWORK PARAMETERS; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICE MODELS;

MULTIPINS BACKPLANE CONNECTORS;

ELECTRIC CONNECTORS;

EID: 0031364659     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)