Ultra-thin multilayer nanomembranes for short wavelength deformable optics

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2004, Pages 77-80

  Tripp, Marie K ^a   Herrmann, Cari F ^b   George, Steven M ^a,b   Bright, Victor M ^a  

^a UCB 450   (United States)

^b UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADAPTIVE OPTICS; CHARACTERIZATION; DEFORMATION; ETCHING; FABRICATION; FLIP CHIP DEVICES; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; OPTICAL PROPERTIES; SPECTRUM ANALYSIS; THICKNESS CONTROL; THIN FILMS;

ATOMIC LAYER DEPOSITION; BULK SUBSTRATES; DEFORMABLE MULTILAYER MEMBRANES; XENON DIFLUORIDE;

MULTILAYERS;

EID: 3042700089     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. G. Vdovin, P.M. Sarro, and S. Middelhoek, "Technology and Applications of Micromachined Adaptive Mirrors," in J. Micromech. Microeng., vol.9, pp. R8-R20, 1999.
2. P.K.C. Wang, and F.Y. Hadaegh, "Computation of Static Shapes and Voltages for Micromachined Deformable Mirrors with Nonlinear Electrostatic Actuators," in J. Microelectromech. Syst., vol. 5, pp. 205-219, 1996.
3. D. Attwood, Soft X-Rays and Extreme Ultraviolet Radiation, Cambridge University Press, Cambridge UK, 1999.
4. C.J. Chang-Hasnain, "Tunable VCSEL", in IEEE Journal of Selected Topics in Quantum Electroincs, Vol. 6, No. 6, pp. 978-987, 2000.
5. S. M. George, A. W. Ott and J. W. Klaus, "Surface Chemistry for Atomic Layer Growth," J. Phys.Chem., Vol. 100, pp.13121-1313, 1996.
6. M. Walters, J. Carter, A. Cowen and G. Hames, SOIMUMPs Design Handbook, rev. 2.0, JDS Uniphase 2002.
7. J. W. Elam, M. D. Groner, and S. M. George, "Viscous flow reactor with quartz crystal microbalance for thin film growth by atomic layer deposition", Rev. Sci. Instr., vol. 73, pp. 2981-2987, 2002.
8. Singh, D.S. Horsley, M.B. Cohn, A. P. Pisano, and R.T. Howe, "Batch Transfer of Microstructures using Flip-Chip Solder Bump Bonding", in Digest Tech. Papers Transducers '97 Conference, City, Chicago, June 16-19, 1997, pp. 265-268.
9. R. S. Irwin, W. Zhang, K. F. Harsh, and Y. C. Lee, "Quick Prototyping of Flip Chip Assembly with MEMS," in Proceedings of the 1998 IEEE Radio and Wireless Conference (RAWCON '98), Colorado Springs, CO, August 9-12, 1998, pp. 293-296.
10. L. Liew "Polymer-Derived Silicon Carbon Nitride as a New Technology for Microelectromechanical Systems," PhD thesis, University of Colorado at Boulder, 2002, Appendix B.
11. M. DiGiovanni, Flat and Corrugated Diaphragm Design Handbook, Marcel Dekker, New York 1982, pp. 130-156.
12. J.W. Beams, Structure and Properties of Thin Films, ed. by C.A. Neugebaur, J.B. Newkirk, and D.A. Vermilyea, Wiley and Sons, New York, 1959, pp. 183-182.
13. C.T. Loy, S.C. Pradhan, T.Y. Ny, and K.Y. Lam, "A Series Solution Approach to an Analytical Load Deflection Relation for the Measurement of Mechanical Properties of Thin Films," in J. Micromech. Microeng., vol. 9, pp. 341-344, 1999.