Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-K dielectrics

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2004, Pages 68-73

  Chen, F ^a   Gill, J ^a   Harmon, D ^a   Sullivan, T ^a   Li, B ^a   Strong, A ^a   Rathore, H ^a   Edelstein, D ^b   Yang, C C ^a   Cowley, A ^a   Clevenger, L ^a  

^a IBM MICROELECTRONICS   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Cu interconnect; Electromigration; Heat conduction; ILD; Joule heating; Low k; Reliability; Thermal conductivity

Indexed keywords

CU INTERCONNECTS; DIELECTRIC CONFIGURATIONS; JOULE HEATING; LOW-K;

APPROXIMATION THEORY; COPPER; ELECTRIC CURRENTS; ELECTROMIGRATION; HEAT CONDUCTION; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; SILICATE MINERALS; THERMAL CONDUCTIVITY; THERMOMETERS; VLSI CIRCUITS;

DIELECTRIC MATERIALS;

EID: 3042561387     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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