Temperature dependence of anti-adhesion between a stamper with sub-micron patterns and the polymer in nano-moulding processes

Journal of Physics D: Applied Physics

Volumn 37, Issue 12, 2004, Pages 1624-1629

  Lee, Namseok ^a   Kim, Young Kyu ^a   Kang, Shinill ^a  

^a Yonsei University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; HIGH TEMPERATURE EFFECTS; LITHOGRAPHY; POLYMERS; REACTIVE ION ETCHING; SURFACE PROPERTIES; ULTRAVIOLET RADIATION;

NANO-IMPRINT LITHOGRAPHY; NANO-MOLDING PROCESSES; SUB-MICRON PATTERNS; TEMPERATURE DEPENDENCE;

NANOSTRUCTURED MATERIALS;

EID: 3042551479     PISSN: 00223727     EISSN: None     Source Type: Journal    
DOI: 10.1088/0022-3727/37/12/006     Document Type: Article

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