Effects of processing method and additive composition on microstructure and thermal conductivity of Si3N4 ceramics

Journal of the European Ceramic Society

Volumn 26, Issue 4-5, 2006, Pages 711-718

  Zhu, Xinwen ^a   Zhou, You ^a   Hirao, Kiyoshi ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Grain growth; Reaction; Si3N4; Sintering; Thermal conductivity

Indexed keywords

ADDITIVES; BONDING; COMPOSITION; DENSIFICATION; GRAIN GROWTH; MICROSTRUCTURE; SILICON NITRIDE; SINTERING; THERMAL CONDUCTIVITY;

NITRIDATION; SINTERED REACTION BONDED SILICON NITRIDE; SINTERED SILICON NITRIDE;

CERAMIC MATERIALS;

CERAMICS;

EID: 29944438329     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jeurceramsoc.2005.07.027     Document Type: Article

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