Effect of sintering additive composition on the processing and thermal conductivity of sintered reaction-bonded Si3N4

Journal of the American Ceramic Society

Volumn 87, Issue 7, 2004, Pages 1398-1400

  Zhu, Xinwen ^a   Zhou, You ^a   Hirao, Kiyoshi ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; BONDING; COMPOSITION EFFECTS; DENSIFICATION; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; NITRIDING; PHASE COMPOSITION; SINTERING; THERMAL CONDUCTIVITY; YTTERBIUM COMPOUNDS; YTTRIUM COMPOUNDS;

MICROSTRUCTURAL EVOLUTION; POSTDENSIFICATION; SINTERABILITY; SINTERED REACTION BONDED SILICON NITRIDE;

SILICON NITRIDE;

EID: 4344637590     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2004.tb07747.x     Document Type: Article

References (17)

1. 4 Ceramics through Improved Processing," Ceram. Eng. Sci. Proc., 16 [4] 475-87 (1995).
2. K. Hirao, K. Watari, M, E. Brito, M. Toriyama, and S. Kanzaki, "High Thermal Conductivity in Silicon Nitride with Anistropic Microstructure," J. Am. Ceram. Soc., 79 [9] 2485-88 (1996).
3. 4 Ceramics," J. Mater. Res., 14 [4] 1538-41 1 (1999).
4. 4: III, Effect of Rare-Earth (RE=La, Nd, Gd, Y, Yb, and Sc) Oxide Additives," J. Am. Ceram. Soc., 84 [2] 353-58 (2001).
5. 2 Addition as a Means of Increasing the Thermal Conductivity of β-Silicon Nitride," J. Am. Ceram. Soc., 84 [12] 3060-62 (2001).
6. 4 Ceramics," J. Eur. Ceram. Soc., 23, 1183-91 2003).
7. T. N. Tiegs, J. O. Kiggans, and Z. L. Ploetz, "Cost-Effective Sintered Reaction-Bonded Silicon Nitride for Structural Ceramics," Ceram. Eng. Sci. Proc., 14 [1-2] 378-88 (1993).
8. T. N. Tiegs, J. O. Kiggans, F. C. Montgomery, H. T. Lin, D. L. Barker, J. D. Snodgrass, E. M. Sabolsky, and D. W. Coffey, "Effect of Composition on the Processing and Properties of Sintered Reaction-Bonded Silicon Nitride," Ceram. Eng. Sci. Proc., 17 [3] 354-62 (1996).
9. 4 by X-ray Diffraction," J. Mater. Sci. Lett., 11, 1370-72 (1992).
10. N. Hirosaki, Y. Okamoto, M. Ando, F. Munakata, and Y. Akimune, "Thermal Conductivity of Gas-Pressure-Sintered Silicon Nitride," J. Am. Ceram. Soc., 79 [11] 2878-82 (1996).
11. H. M. Jennings, "Review: On Reactions between Silicon and Nitrogen: I, Mechanisms," J. Mater. Sci., 18, 951-67 (1983).
12. 4 Compacts," J. Mater. Sci., 20, 3545-56 (1985).
13. A. Eucken, "Thermal Conductivity of Ceramic Refractory Materials; Calculation from Thermal Conductivities of Constituents," Forsch. Gebiete Ingenieurw., B3 [353] 16 (1932).
14. 4: II, Effect of Lattice Oxygen," J. Am. Ceram. Soc., 83 [8] 1985-92 (2000 ).
15. W. J. Kim, D. K. Kim, and C. H. Kim, "Morphological Effect of Second Phase on the Thermal conductivity of AlN Ceramics," J. Am. Ceram. Soc., 79 [4] 1066-72 (1996).
16. F. Boey, A. I. Y. Tok, Y. C. Lam, and S. Y. Chew, "On the Effects of Secondary Phase on Thermal Conductivity of AlN Ceramic Substrates Using a Microstructural Modeling Approach," Mater. Sci. Eng., A., 335, 281-89 (2002).
17. A. D. Pablos, M. I. Osendi, and P. Miranzo, "Effect of Microstructure on the Thermal Conductivity of Hot-Pressed Silicon Nitride Materials," J. Am. Ceram. Soc., 85 [1] 200-206 (2002).