Post-densification behavior of reaction-bonded silicon nitride (RBSN): Effect of various characteristics of RBSN

Journal of Materials Science

Volumn 39, Issue 18, 2004, Pages 5785-5797

  Zhu, Xinwen ^a   Zhou, You ^a   Hirao, K ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COVALENT BONDING; LIQUID PHASE SINTERING; POST-DENSIFICATION; REACTION-BONDED SILICON NITRIDE (RBSN);

AGGLOMERATION; BONDING; COMPOSITION; CRYSTALLINE MATERIALS; DENSIFICATION; MATHEMATICAL MODELS; MICROSTRUCTURE; PORE SIZE; SCANNING ELECTRON MICROSCOPY; SINTERING;

SILICON NITRIDE;

EID: 4444317202     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSC.0000040090.33370.66     Document Type: Article

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