Modeling of the curing kinetics of no-flow underfill in flip-chip applications

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 2, 2004, Pages 383-390

  Zhang, Zhuqing ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DIFFERENTIAL SCANNING CALORIMETRY; FLIP CHIP DEVICES; GELATION; HEATING; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; REACTION KINETICS; SOLDERING ALLOYS; THERMAL EXPANSION; THERMOCOUPLES; WETTING;

AUTOCATALYTIC MODEL; CURING KINETICS; HEATING RATES; NON FLOW UNDERFILL; SOLDER WETTING BEHAVIOR; THERMAL EXPANSION COEFFICIENT;

ELECTRONICS PACKAGING;

EID: 3242772916     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.828556     Document Type: Article

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